It is a container filled with high-temperature saturated water vapor, and high-pressure can be applied. The laminated substrate (laminates) sample can be placed in it for a period of time to force moisture into the board, and then take out the sample again. Place it on the surface of high-temperature molten tin and measure its “delamination resistance” characteristics. This word is also synonymous with the pressure cooker, which is commonly used by the industry. In addition, in the multilayer board pressing process, there is a “cabin press method” with high temperature and high-pressure carbon dioxide, which is also similar to this type of Autoclave Press.

It refers to the traditional lamination method of early multilayer PCB boards. At that time, the “outer layer” of MLB was mostly laminated and laminated with a single-sided copper thin substrate. It was not used until the end of 1984 when the output of MLB significantly increased. The current method is the copper-skin type large or mass pressing method (Mss Lam). This early MLB pressing method using a single-sided copper thin substrate is called cap lamination.

The multilayer board pressing often refers to the wrinkles that occur when the copper skin is improperly handled. Such shortcomings are more likely to occur when thin copper skins are below 0.5 oz and laminated in multiple layers.

It refers to the gentle and uniform sag on the copper surface, which may be caused by the partial protrusion of the steel plate used in pressing. If it shows a neat drop of the faulty edge, it is called “dish down.” If these shortcomings are left on the line after copper corrosion, the impedance of the high-speed transmission signal will be unstable, and noise will appear. Therefore, such a defect should be avoided as much as possible on the substrate’s copper surface.

When the multilayer board is pressed, in each opening of the press, there are often many “books” of bulk materials (such as 8-10 sets) of the board to be pressed. Each set of “bulk materials” (Opening) Book) must be separated by a flat, smooth, and hardened stainless steel plate. The mirror stainless steel plate used for this separation is called “caul plate” or “separate plate.” At present, AISI 430 or AISI 630 are commonly used.

Refers to the mass-produced multilayer board, the outer layer of copper foil and film are directly pressed with the inner skin, which becomes the mass lam of the multilayer board. This replaces the early traditional single-sided thin substrate Press legal.

When multilayer boards or substrate boards are laminated, kraft paper is often used as a heat transfer buffer. It is placed between the hot plate (Platern) of the laminator and the steel plate to ease the temperature rise curve closest to the bulk material. Between multiple substrates or multilayer boards to be pressed. Try to minimize the temperature difference of each layer of the sheet; the commonly used specifications are 90 to 150 pounds. Because the fiber in the paper has been crushed after high temperature and high pressure, it is no longer tough and difficult to function, so it must be replaced with a new one. This kind of kraft paper is co-cooked with a mixture of pinewood and various strong alkalis. After the volatiles escape and the acid is removed, it is washed and precipitated. After it becomes pulp, it can be pressed again to become rough and cheap paper material.

When the multilayer board is pressed and the plates are placed and positioned, they will start to heat and be lifted by the hottest layer from the bottom. Afterward, lift with a powerful hydraulic jack (ram) to press each opening (bulk materials in the opening) and are bonded together. At this time, the combined film (prepreg) begins to gradually soften or even flow, so the pressure used for the top extrusion cannot be too large. This is to avoid slippage of the sheet or excessive flow of the glue. This lower pressure (15-50 PSI) initially used is called “kiss pressure.” However, when the resin in the bulk materials of each film is heated to soften and gel and is about to harden. It is necessary to increase to the full pressure (300-500 PSI) so that the bulk materials are tightly combined to form a strong multilayer board.

Before pressing multilayer circuit boards or substrates, various bulk materials such as inner layer boards, films and copper sheets, steel plates, kraft paper pads, etc., need to be aligned, aligned, or registered up and down to prepare. Then it can be carefully fed into the pressing machine for hot pressing. This kind of preparatory work is called Lay Up. To improve the quality of multilayer boards, not only this kind of “stacking” work must be carried out in a clean room with temperature and humidity control, but also for the speed and quality of mass production. Generally, the large-scale press method (Mass Lam) in construction, even “automated” overlapping methods are needed to reduce human error. To save workshops and shared equipment, most factories combine “stacking” and “folding boards” into a comprehensive processing unit, so automation engineering is quite complicated.

You probably want to widen your knowledge about multilayer PCB. This is one good reason why you have visited this page. Also, you may wish to import multilayer Printed Circuit Boards. Whatever the case may be, our guide will offers the best solution for all your PCB needs.